Used SMT and AI Machine Sales

MACHINES IN STOCK

SMT Related Equipment

Thermo Bonding Products

Test & Measurement Machines

PCB Handling Systems

Automated Optical Inspection

Vacuum Sealers

Dry Box

Cutting and Forming Machines

Feeders

Spare Parts

Products > Thermo Bonding Products

TM-101P-MKIII Pulse Heat Machine

Equipped with semi-automatic operations with linear moving stage, TM-101P-MKIII Pulse Heat Machine is capable of performing ACF Bonding, HSC Bonding and Hot Bar Soldering applications. The integrated Intelli-Pulsesystem offer accurate temperature control as the parameter settings are automatically adjusted. It also features a LCD touch panel systems offers fast and easy programming, storing and recalling of parameter settings.

Key Features and Benefits

Versatile system that can produce a variety of applications Interchangeable Silicone Rubber and polyamide tape indexing mechanism
Microprocessor based pulse heat controller provides better temperature profile control B/W CCTV System for fine pitch alignment
4 stage ramp temperature Leveling mechanism for accurate co-planarity adjustment
Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted Storage up to 20 programmable profiles
Real time temperature profile display User pre-set password for maximum protection

LCD touch panel controller

 Customisation available
Manual mode for machine set-up Over temperature protection

Specifications

Heating Method (Top) Pulse Heat Bonding Force 3.4Kgf - 74Kgf
Power Requirement 220VAC+/-10%, 50/60 Hz, 3kVA Max. Thermode Size 75mm x 2mm
Operating Ambient 23ºc +/-5ºc, 40 to 100% humidity with no significant dust Thermocouple Type K Type
Supply Pressure Filtered Clean and Dry Air, 5 - 7kgf/cm² Visual Aids 2 sets of B/W CCTV
Preset Start Temp. 30ºC to 300ºC Work Table Size 120mm x 120mm
Preset Ramp Temp 1st - 4th Ramp Temp., 30ºC to 450ºC Work Area 420mm x 420mm
Preset Hold Period 1st - 4th Hold Period, 1 to 100 seconds Dimensions 800mm (L) x 800mm (W) x 1290mm (H)
Ramp Period 1st - 4th Ramp Period, 1 to 25 seconds Weight Approx. 200kg
Preset Release Temp 30ºC to 450ºC    
 

TM-101PR-MKIII Pulse Heat Machine

TM-101PR-MKIII Pulse Heat Machine is a versatile system equipped with the capability of producing a wide variety of joining applications such as ACF Bonding, HSC Bonding and Hot Bar Soldering applications. You can achieve maximum output with the rotary table that allows simultaneous loading and unloading of substrates. The integrated Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted. It also features a LCD touch panel systems offers fast and easy programming, storing and recalling of parameter settings.

 

Key Features and Benefits

Versatile system that can produce a variety of applications

Manual mode for machine set-up
Microprocessor based pulse heat controller provides better temperature profile control Dual thermocouple ensures over temperature protection
Semi-automatic operation with rotary table Interchangeable Silicone Rubber and polyamide tape indexing mechanism
4 stage ramp temperature B/W CCTV System for fine pitch alignment
Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted Leveling mechanism for accurate co-planarity adjustment
Real time temperature profile display Storage up to 20 programmable profiles
LCD touch panel controller User pre-set password for maximum protection
Over temperature protection Customisation available

Specifications

Heating Method Pulse Heat Bonding Force 3.4Kgf - 74Kgf
Power Requirement 220VAC+/-10%, 50/60 Hz, 4.5kVA Max. Thermode Size 75mm x 2mm
Operating Ambient 23ºc +/-5ºc, 40 to 100% humidity with no significant dust Thermocouple Type K Type
Supply Pressure Filtered clean air, 5-7 kgf / cm² Visual Aids 2 sets of B/W CCTV
Preset Start Temp. 30ºC to 300ºC Work Table Size 120mm x 120mm
Preset Ramp Temp 1st - 4th Ramp Temp., 30ºC to 450ºC Work Area 420mm x 180mm
Preset Hold Period 1st - 4th Hold Period, 1 to 100 seconds Dimensions 800mm (L) x 800mm (W) x 1290mm (H)
Ramp Period 1st - 4th Ramp Period, 1 to 25 seconds Weight Approx. 200kg
Preset Release Temp 30ºC to 450ºC    

TM-111-MKIII Reflow (Hot Bar) Soldering Machine

TM-111-MKIII is designed specifically for hot bar soldering of flex circuits, TAB and flexible connectors onto PCBs. The system uses pulse heat as a source for heating, which is capable of spontaneous heating and cooling. Other features include 20 programmable profiles and a LCD touch panel controller .

Key Features and Benefits

Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted

 Dual thermocouple ensures over temperature protection
LCD touch panel controller for easy programming 20 programmable profiles
User pre-set password CE Certified

Application

  • Hot Bar Soldering of Flex Circuits
  • Hot Bar Soldering of Flexible Connectors
  • Reflow Soldering of TAB

Specifications

Heating Method Pulse Heat Weight Approx. 85kg
Power Requirement 220VAC±10%, 50/60Hz, 2KVA Max. Thermode Size 55mm x 3mm
Operating Ambient 23ºC +/-5ºC, 40 to 100% humidity with no significant dust Thermocouple Type K Type
Supply Pressure Filtered Clean and Dry Air, 5 - 7kgf/cm² Program Capacity 20 Programs
Preset Start Temp 1st-4th ramp temp 30°C - 300°C Password User Preset
Preset Ramp Temp. 1st-4th ramp temp 30°C - 450°C System Type Table Top
Preset Release Temp. 1st-4th ramp temp 30°C - 450°C Dimensions 700mm (L) x 600mm (W) x 588mm (H)
Bonding Force 1kgf - 40kgf Work Table Size 180mm x 180mm

TM-118P-TFT Semi-Automatic TAB Bonding Machine (Bonding of TAB to TFT & PCB(PWB) 

High performance Semi-Automstic TAB Bonding Machine TM-118P-TFT is specifically designed for bonding of TAB to LCD and PCD of TFT panels up to 10-23 inches. TM-118-TFT is also well suited for TAB rework applications. This system is able to perform soldering of TAB substrates to PCB. By changing the polyamide tape with a silicone rubber, the machine can be used to perform heat-sealing of Heat-seal connector and bonding of TAB to LCD panels.

Application

  • Ability to perform TAB Bonding and Hot Bar Soldering of TAB to TFT and PCB (PWB)
  • Suitable for large TFT panels measuring at 10-23 inches

Specifications

Heating Method Pulse Heat Pulse Heat Specifications
Power Requirement 230VAC +/-10%, 50/60 Hz, 3.5kVA Bonding Force 4kgf - 72kgf
Operating Ambient 10-40ºC, 40 to 100% humidity with no significant dustFiltered Temperature Ramp Profile 2 Stages
Supply Pressure Filtered Clean and Dry Air,5 - 7kgf/cm² Start Temp. 30ºC to 300ºC
Visual Aids

2 units of colour CCD (at bottom)

2 units of colour CCD (at top)

 Ramp Temp. 30ºC to 400ºC
Work Table Size

650mm x 650mm

 Ramp Period. 1 to 25 seconds
Monitors 10.4" TFT monitors Hold Period. 1 to 100 seconds
LCD Size 10" to 23" Release Temp 30ºC to 400ºC
 PCB Size X:90mm xY:10mm ~X:530mm xY:100mm Thermode Specification
 Indexing Selectable 15 position for bonding Max. Thermode Size

65mm x 2mm
 User Interface LCD Touch Panel Thermocouple Type

K Type
Programmable Profiles 40

 
Dimensions 1900mm(L) x 1250mm(W) x 1683mm(H)

 

TM-35GL Rigid to Rigid Lamination Machine

Rigid to Rigid attachment machine (TM-35GL) is designed for attachment of Hard Cover to Glass inside vacuum chamber with bottom heating & roller. The process assumes that the Touch Panel comes attached with ITO FILM. This machine has the flexibility of attaching substrate size from 2”~5”.

Application

  • FOG Bonding, TAB Bonding to LCD

Key Features and Benefits

Integrated with high accuracy constant heat controller

   Motorized roller
Built-in vacuum generator Manual mode for machine set-up
20 programmable profiles can be stored electronically


Specifications

Power Requirement 1 phase, 220VAC +/-10%, 50/60 Hz,
Operating Ambient 23ºC +/-5ºC, 40 to 100% humidity with no significant dust
Supply Pressure Filtered Clean and Dry Air,  5 – 7kgf/cm²
Programmable Profiles 20
Work Table size 262mm X 206mm
Work Holder Single Cavity
Dimensions 580mm (L) x 735mm (W) x 912mm (H)
Weight Est. 150kg
Bonding Force 5.0kgf – 120kgf
Rolling force 3kgf ~ 48kgf

Product Specifications
Hard cover size 2” ~ 5”
Hard cover thickness 0.3mm ~ 1.0mm
Glass size 2” ~ 5
Glass thickness 0.3mm ~ 2.0mm


TM-388P FOG AUTOMATIC BONDING MACHINE

TM-388P is designed for FOG (Flex on Glass) applications. The machine is integrated with ACF pre-attachment, auto alignment/pre-bond and final bond modules into a single system. Auto alignment/pre-bond module is integrated with FPC (COF/TAB) handling unit. TAB punching unit can be integrated into FPC handling unit as an upgrading option. 

A substrate handling system incorporating loader/unloader and panel orientating mechanism ensures seamless and fast operations. 

The Final Bond units is equipped with Cherusal INTELLIPULSE system, which provides the advantages for rapid temperature ramping, reducing heat-sinking effect on substrate, cooling process (after bonding) and reduction in power consumption.

Application

  • Precision bonding of TAB or FPC to glass panel

Key Features and Benefits

Pulse heated final bond stations equipped with INTELLIPULSE system
Substrate handling system for fast and cotinuous processes
High speed auto alignment system
FPC handling unit transfers flex direct to Alignment/Pre-bond module
For LCD panel sizes ranging from 1" to 6"

Specifications

Utility
Power Supply 1 phase, 208V ± 10V, 50/60 Hz
Compressed air supply Pressure 5kg/cm² {regulator install at input side}
Vacuum supply 1. Utility vacuum supply - 600mm/Hg
2. Vacuum pump installed (facility source & pump source switch value)
Air inlet 1µm filter & regulator installed
Air consumption rate 280l/min
Product Specification
LCD panel 1" - 6"
Machine Specification
Machine dimension 4300mm (L) x 1750mm (W) x 220mm (H) - With Tower Light
Machine weight Approx. 2000kg
Vision System Unit
Color Camera ¼ CCD Camera
Field of View 3.5mm x 2mm
Optical Magnification 100 Magnification
Top and Bottom ACF Dispensing
Heating Method Constant Heat
Bonding Force 3.5kgf - 70kgf
Hold Temperature RT - 300ºC
Hold Period 0.1sec - 25sec
ACF Cutting Method Half Cut
ACF Indexing Accuracy ±0.2mm
Pre-Bond Station
Heating Method Constant Heat
Pre-bond Temperature 150ºC
Pre-bonding Accuracy ±7µm
Final Bond Station (Top and Bottom)
Heating Method Pulse Heat
Bonding Force 3.5kgf - 70kgf
Temperature Ramp Profile 04 Stages
Ramp Period (1st to 4th) RT - 450ºC
Bonding Accuracy ±10µm;

Product Specifications
Hard cover size 2” ~ 5”
Hard cover thickness 0.3mm ~ 1.0mm
Glass size 2” ~ 5
Glass thickness 0.3mm ~ 2.0mm


TM-700 Automatic TAB/COF Punching Machine 

Equipped with an automatic tape feeding system, Automatic TAB/COF Punching Machine TM-700 is designed for automatic and continuous punching of TAB or COF. This machine offers easy setup, high effciency and user-friendly interface. Various sizes of TAB/COF can be used in this machine by changing preset values and changing some mechanical parts such as TAB Reel and Take up Reel. Changing of die set/punching tools is easy and conveniet; TM-700 also allows customisation of punching tools according to customer requirements. 

Key Features and Benefits

Automatic tape feeding system

   Fast indexing speed at 5 sec per cycle
Flim thickness of up to 150µm can be processed Changeable Die Set
Customisation of punching tools available 20 programmable profiles
LCD touch screen controller  

Application

  • Automatic punching of TAB or COF

Specifications

Power Requirement 230VAC | 10% Free from momentary surge and failure
Cycle Time 4 sec (including indexing time)
Punching Force 1000Kgf
Punching perimeter

76mm (L) x 70mm (W)
Indexing motor

Stepper motor
Reel Width 35mm - 70mm
Cutting accuracy X axis Y axis
±100µm ±100µm
Process counter with alarm 5 digits
Dimension

1600mm (L) x 800mm(W) x 1500mm*(H)

*Height:1800mm (inclusive of tower light)
Weight Approx. 400kg


Specifications

Hard cover size 2” ~ 5”
Hard cover thickness 0.3mm ~ 1.0mm
Glass size 2” ~ 5
Glass thickness 0.3mm ~ 2.0mm

TM-807C Semi-Automatic COG Pre-bond Machine

Semi-automatic COG Pre-bonding Machine TM-807C is specifically designed for pre-bonding a wide array of IC to LCD panels. TM-807C offers several variation in handling IC and LCD. Alignment, placement of IC and pre-bonding process can be completed in a fully automatic operation with only loading & unloading of substrates done manually by operators. The machine can be activated using the ergonomically designed Optical Touch Button.

Key Features and Benefits

Maximum productivity can be achieved with the integrated Dual Pre-bonding head that allows up to 2 substrates to be loaded each time   LCD touch panel for parameter settings and real time display of IC alignment images
Automatic program pick-up of IC Co-planarity Adjustment Mechanism 
·Automatic IC X/Y Orientation Mechanism Unique Frame Grabber System for alignment  
Ability to handle IC and substrates of various sizes  

Application

  • Applicable to Glass and Flex substrates and a wide range of substrate sizes

Specifications

Machine Specification
Power Supply Single Phase, 230V ± 10%, 50Hz/60Hz, 2KVA User Interface 17" TFT Touch Panel
Operating Ambient 23 ± 5˚C, 40% ~ 100% Humidity, Controlled Environment Vacuum Source Vacuum Ejector - 84kPa x 4 No.
Control System Embedded System 17" LCD Touch Screen Controller Machine Weight Approx. 1000kg
Machine Dimension 1300mm (L) x 1000mm (W) x *1510mm (H) 
*Height: 1810mm (inclusive of tower light)
Pre-bond Specification
Pre-bond Heating Method Contant Heat Pressure Control Manual Precision Regulator with Pressure Gauge
Pre-bond Temp. 150°C (max)
Pre-bond Period 1sec ~ 20sec
Air Pressure Supply Filtered Clean and Dry Air, 6Kg/cm² Pre-bonding Force 0.5kgf ~ 12kgf (± 0.1kgf)
Pre-bonding Accuracy ± 3µm
Heater Block Specification
Heater Block Dimensions 26mm x 5.5mm Heating Source Heater Cartridge
Heater Block Material Tool Steel Hardened to HRC 52 Thermocouple Type K Type
Heater Block Flatness ± 1µm
Vision Systems Specification
Camera System Hi-resolution USB Camera Lens Hi-resolution Tele-centric Lens
Light Source Fiber Optics for Co-axial Magnification Approx. 400X
Vision System 1 unit of Camera System with Telecentric Lens Alignment Method Auto-alignment with Global Co-ordinates
Drive Method X and Y Axis on Servo Motor
IC/Substrates Specification
IC Dimensions 3mm x 1mm x 0.4mm ~ 25mm x 5mm x 0.8mm Substrate Dimensions 20mm x 20mm ~ 130mm x 200mm
Chip Supply Direction IC Face Down IC Orientation Mechanism Servo Motor on Positioning Pockets
No. of IC Tray 8 Trays (2"x2" IC Trays) 4 Trays (2"x2" IC Trays) + 1 Tray (3"x3" IC Trays)
2 Trays (4"x4" IC Trays) 4 Trays (2"x2" IC Trays) + 1 Tray (4"x4" IC Trays)
2 Trays (3"x3" IC Trays) 2 Trays (2"x2" IC Trays) + 2 Trays (3"x3" IC Trays)
  1 Tray (3"x3" IC Trays) + 1 Tray (4"x4" IC Trays)

TM-808P COG  Final Bond Machine

COG Final Bond Machine TM-808P provides the final-compression of pre-bonded COG modules. Integrated with Pulse Heat system, the Intelli-Pulsecontroller ensures precise and accurate temperature profile at any stage of the bonding process. Bonding pressure is controlled electronically for consistent output bonding force. All other considerations for bonding such as co-planarity adjustment and built vacuum are available in the machine to achieve good and reliable final bond quality.

Key Features and Benefits

Semi-automatic Operation

   Touch Panel User Interface with Real Time Temperature Profile 
Integrated with Pulse Heat system  Co-planarity Adjustment Mechanism 
Intelli-Pulse controller  Manual Mode Function for machine set up 
Suitable for a wide range of substrates sizes User Pre-set Password

Application

  • Applicable to Glass and Flex substrates and a wide range of substrate sizes

Specifications

Machine Specification
Power Supply Single Phase, 230V ± 10%, 50Hz/60Hz, 3.5KVA Co-planarity Adjustment Yes 
Operating Ambient 23 ± 5˚C, 40% ~ 100% Humidity, Controlled Environment Silicone or Teflon Rubber Indexing Yes
Control System Microprocessor Based Real Time Temp. Display Yes
Air Pressure Supply Filtered Clean and Dry Air, 6Kg/cm² Pressure Control Electronics Pressure Regulator
User Interface Touch Panel User Interface  Password User Pre-set
Vacuum Source Vacuum Ejector - 84kPa Machine Weight Approx. 250kg
Machine Dimension 420mm (L) x 700mm (W) x 1380mm (H)
Final Bond Specification
Final Bond Heating Method Pulse Heated Bonding Force 1.5kgf ~ 44kgf
Ramp Temp. RT ~ 450°C (max)
Ramp Period 1sec ~ 25sec
Hold Period 1sec ~ 100sec
Release Temp. RT ~ 450°C
Temp. Ramp Stage 4
Bonding Accuracy ≤ 3µm
Thermode Specification
Thermode Flatness ± 3µm (at room temperature) Thermode Material Hotvar
Thermocouple Type K Type Max. Thermode Dimensions 38mm x 6mm
IC/Substrates Specification
IC Dimension (max) 1mm x 3mm ~ 5mm x 25mm Substrate Dimensions 20mm x 20mm ~ 130mm x 200mm
Loading Method Front with Side Guide

TM-90-MKIII ACF PRE-ATTACHMENT MACHINE

TM-90-MKIII-1 ACF Pre-attachment Machine is ideally suited for production needs in the attachment of Anisotropic Conductive Film (ACF) onto LCD, glass panel, flexible circuits, PCB and a wide variety of substrates. Constant heat is utilized as the heating source to ensure consistency in the temperature across the heater block. Generally, ACF is preattached onto the substrates prior to bonding of TAB or Flex circuits. The automatic operation process comprises of ACF lamination, peeling and half-cut operation. This high performance ACF dispensing system has the ability to handle both single and double ACF protective layer. The integrated universal ACF collet is also compatible with a wide variety of ACF.

Key Features and Benefits

Integrated with high accuracy constant heat controller

 High performance system that handles single or double ACF protective layer
Half-cut mechanism Universal ACF collets and guides applicable to a wide variety of ACF
Semi-automatic operation in linear moving stage provides fast and safe loading and unloading of substrates Leveling mechanism adjustment on press assembly
Built-in vacuum Manual mode for machine set-up
20 programmable profiles can be stored electronically LCD touch screen controller for easy programming and parameter data storage and recall

Application

  • Dispensing of ACF onto PCB, LCD and Flex Circuits

Specifications

Heating Method Constant Heat
Power Requirement 220VAC +/-10%, 50/60 Hz, 0.75kVA
Operating Ambient 23ºC +/-5ºC, 40 to 100% humidity with no significant dust
Supply Pressure Filtered Clean and Dry air, 5-7 kgf / cm²
Programmable Profiles 20
Work Table Size 180mm x 180mm
Work Area 180mm x 180mm
LCD Panel Size 100mm (L) x 200mm (W)
Dimensions 600mm (L) x 600mm (W) x 1420mm (H)
Weight Est. 110kg
Constant Heating Specifications
Hold Temp 30ºC to 300ºC
Hold Period 0.1 to 25 seconds at 0.05 seconds accuracy
ACF Delay to Peel 0 to 5 seconds
ACF Tape Advance 2mm to 80mm at 0.1 interval
ACF Width 1.5mm to 8mm
ACF Type Single/ Double Protective Layer
ACF Cutting Method Half Cut
ACF Placement Accuracy X= +/-0.1mm, Y= +/-0.1mm
Heater Block Specifications
Bonding Force 2.0kgf – 48kgf
Heater Block Size 5mm x 1.5mm (min) to 80mm x 8mm (max)
Thermocouple Type K Type

TM-300PR-MKIII TAB Bonding Machine

Specifically designed for fine pitch TAB Bonding, TM-300PR-MKIII TAB Bonding Machine is equipped with an ergonomically designed bottom vision camera system capable of fine pitch alignment and allows you to enhance ITO and TAB conductive lines clarity. The utilization of pulse heat technology allows better temperature control and repeatability needed for fine pitch TAB Bonding process. The integrated Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted.

Key Features and Benefits

High accuracy microprocessor basedpulse heat controller

 Manual mode for machine set-up
Bottom view camera system for fine pitchapplications Storage up to 20 programmable profiles
Accurate co-planarity adjustment mechanism LCD touch panel controller
4 stage ramp temperature Built-in securitypassword system
Intelli-Pulse system offer accurate temperature control as the parameter settings are automatically adjusted Customisation available
Over temperature protection  

Application

  • ACF Bonding for TAB to LCD
  • ACF Bonding for Flex Printed Circuit to LCD

Specifications

Heating Method Pulse Heat Bonding Force 3.4Kgf - 71Kgf
Power Requirement 220Vac 100% Free from momentary surge and failure Max. Thermode Size 75mm x 2mm
Supply Pressure Filtered clean air, 5-7 kgf / cm² Thermocouple Type K Type
Preset Start Temp. 30ºC to 300ºC Visual Aids 2 sets of B/W CCTV below
Preset Ramp Temp 1st - 4th Ramp Temp., 30ºC to 450ºC Work Table Size 120mm x 120mm
Preset Hold Period 1st - 4th Hold Period, 1 to 100 seconds Work Area 420mm x 420mm
Ramp Period 1st - 4th Ramp Period, 1 to 25 seconds Dimensions 800mm (L) x 800mm (W) x 1430mm (H)
Preset Release Temp 30ºC to 450ºC Weight Approx. 300kg